Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing.
Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science presents the role innovative materials have in the critical advanced packaging markets, including artificial intelligence (AI), and high-performance computing. Brewer Science’s presentations and exhibition will be at SEMICON Taiwan, from Sept. 4-6, 2024.
Material Efforts Towards Sustainable Processes
Dr. Douglas Guerrero, Brewer Science’s Senior Technologist, presents “Material Efforts Towards Sustainable Processes” addressing the industry’s most critical questions when it comes to balancing technology innovation with environmental stewardship, including:
- How can the semiconductor industry enhance sustainability while meeting growing consumer demands for eco-friendly practices?
- What innovative solutions are available to reduce energy consumption in EUV lithography processes?
- Can transitioning from thermal baking to UV curing improve both energy efficiency and lithographic performance?
- What are the benefits of optical crosslinking in semiconductor manufacturing, and how does it optimize material design, process efficiency, and tool throughput?
With 30 years of R&D experience in patterning materials and processes, over 20 patents, and 60 publications, Dr. Guerrero combines material expertise and industry leadership to present how sustainable processes can lead to energy savings, while improving tool throughput and maintaining lithographic performance. Attend Dr. Guerrero’s presentation on Sept. 6 at 2:20 pm in 401, 4F at SEMCION Taiwan, as part of the IC Forum – Advanced Chip Technology and Manufacturing.
The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing
Mr. Alexander Smith, Brewer Science’s Executive Director of Semiconductor Materials Business Unit, presents “The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing,” providing an insightful review of the challenges and advancements in packaging materials enabling more efficient and cost-effective flows. Mr. Smith will highlight chemical properties and customizable structures that will offer the most innovative solutions to pressing industry challenges. Attend Mr. Smith’s presentation on Sept. 6 at 12:00 pm in 701GH, 7F at SEMCION Taiwan, a part of the Heterogeneous Integration Global Summit 2024 – Day 3.
Explore New Innovations in Advanced Packaging at Booth I2116
Throughout the events, Brewer Science’s experts will be stationed at booth I2116 in the SEMICON Taiwan Exhibit Hall and available for discussions on how Brewer Science’s materials assist with advanced-node patterning and wafer thinning. A list of Brewer Science’s PFAS-free materials is also available.
- Wednesday, Sept. 4 : 10:00 am–5:00 pm
- Thursday, Sept. 5 : 10:00 am–5:00 pm
- Friday, Sept. 6: 10:00 am–4:00 pm
For those unable to attend, Brewer Science extends an open invitation to explore its packaging solutions and advanced lithography webpages. You can also request datasheets or schedule expert-led consultations on Brewer Science’s website. www.brewerscience.com.
