Nordson will feature fluid dispensing technologies for semiconductor advanced packaging at SEMICON Taiwan. – 3D InCites

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Visit booth #L0516 to discuss the latest developments in fluid dispensing for
advanced semiconductor packaging.

Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.

On display will be the ASYMTEK Forte® system, configured for high productivity and accuracy for many semiconductor packaging and microelectronics manufacturing applications. The Forte system is ideal to tackle high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.

A semiconductor wafer shown on top of a semiconductor panel, inside of a machine. Panel vs. wafer; higher UPH same footprint. Fluid dispensing.
Technologies from Nordson Electronics Solutions are being developed to address challenges during the dispensing process for semiconductor applications. These technologies ensure high-throughput, precise dispense results within the same footprint as current equipment.

Other featured technologies include developments for high-throughput panel-level packaging (PLP) and wafer-level packaging (WLP) and handling the challenges of warpage during dispensing operations. Presentations will be available to show different configurations for WLP and PLP on the ASYMTEK Vantage® fluid dispensing system, and how these systems can successfully ensure precise dispense results with high throughput.

Experts will be ready to discuss how Nordson can support your manufacturing of reliable semiconductor products. SEMICON Taiwan will be held at TaiNEX, Taipei Taiwan, Sept. 4-6, 2024.

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